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Brand Name : CYG
Model Number : CYG-5236
Certification : RoHs, REACH,CE,UL,ISO 14001
Place of Origin : China
MOQ : 500 pce
Price : USD 0.21~3.22 pce
Payment Terms : L/C, T/T, D/P, D/A, Western Union, Money Gram
Supply Ability : 500 tons per month
Delivery Time : 15-20 work days
Packaging Details : PE bags
Density : 25-300 kg/m3
Thickness : 0.2-100mm
Sample : Free
Material : PE,EPE,EVA,PU,etc
Size : Customize
Feature : Non-toxic,shock proof,Shock Resistance,high end showing
Usage : Transportation Protection,Packaging,packing and insulation
Hardness : 20-90 shores
Conductive Fire Resistant Pe Foam Crosslinked Polyethylene Foam Rolls IXPE ESD Foam Sheet
Material Specification of Conductive PE Foam
| Material | IXPE | 
| Type | Conductive IXPE Foam | 
| Thickness | 1-100mm | 
| Color | Black | 
| Surface Resistance | 103-109 Ω | 
| Certificate | SGS, ISO9001, ROHS | 
| MOQ | No MOQ | 
| Size | Custom | 
| Product Keywords | ESD IXPE foam tray | 
  The said product is a close-cell, conductive foam. It is produced by compounding the PE resin with conductive fillers &
blowing agents to extrude certain sheets,then cross-linking and foaming. The basic process can be summarized to the following:
  1 Pellitizing master batch by compounding PE resin with carbon black and AC foaming agents;
  2 Extrude the said batch to make certain sheets with different thickness & width;
  3 Cross link the said sheets under electric beam;
  4 Make the cross linked sheets foam in foaming furnace


  
  Specifications
| 
 | ||||
| Property | Standard | Unit | Value | |
| Density | - | Kg/m³ | 83.00 | |
| Tensile Strength | Transverse | ISO-1798 | MPa | 0.65~0.67 | 
| Longitudinal | 0.98~1.00 | |||
| Elongation | Transverse | ISO-1798 | % | 171.11~198.50 | 
| Longitudinal | 164.30~192.60 | |||
| Tearing Strength | Transverse | ISO-8067 
 | Kn/m | 3.55~3.82 | 
| Longitudinal | 4.80~5.00 | |||
| Operating Temperature Range | Internal | °C | (-40,+80) | |
| Water Absorption % Volume (Maximum) | Internal | % | 0.20 | |
| Thermal Conductivity | JIS A1412-2 | W/mK | 0.095 | |
| Shore - C | ASTM D2240 | °C | 55 | |
| Flammability | FMVSS302 | mm/min | - | |
   
Features
1. With conduction path / network inside. excellent anti static performance;
2. It promotes the rapid release of electrostatic without using the environmental humidity. anti-static performance is not affected by the environmental humidity;
3. Permanent anti-static;
4. Excellent electrical conductivity, surface resistance: 103-109 Ω;
  5. Buffer good performance: independent and fine pore closure;
  6. High temperature resistance: IXPE maximum temperature 80℃
  7. Chemical resistance: resistant to organic solvents, acids, bases, etc.;
  8. No chemical corrosion: It has no corrosion to the components and packaging;
  9. Heat insulation, sound insulation, water absorption, moisture;
  10. Good processing performance, easy molding.
  1. Medium and high quality are often customized to meet different market.
  2. High Cost effective
  3. High fire resistance
  4. Good after-sale service
  5. Strong capacity: One day one container
  6. OEM service, 17 years manufacture experience, sample in stock can be offered in one working day
  
   
Our services
  Factory direct selling with low price, sooner leadtime, customized service.
  
  Comany info
CYG TEFA Co., Ltd, a national high-tech company, established in December of 2002. Now we have 2 production bases in Shenzhen, Hangzhou, with annual production capacity of 6000 tons;
  We are the leading manufacturer for XPE , IXPE foam,ESD foam for more than 17 years, all our products can be used for thermal insulation,waterproof,shockproof,etc. and also our products get the UL, ISO, SGS, Rohs, Reach , CE approval. and we have 17 production lines for production.Hope to cooperate with you.
IXPP project (three years: Proposal stage - Develop - Sampling - Approved product- Small quantity supply for testing
11 employee
  Investment rate: 4% to 10%
  Responsible for : Improving available product / Technology improving / New product development / New devices.
   
Application Field:
  An ideal packing material for optoelectronic devices, integrated circuit, printed circuit board, communications, military products etc.


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